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APTM50HM65FT3 Full - Bridge MOSFET Power Module 13 14 Q1 Q3 VDSS = 500V RDSon = 65m max @ Tj = 25C ID = 51A @ Tc = 25C Application * Welding converters * Switched Mode Power Supplies * Uninterruptible Power Supplies 18 22 19 Q2 23 8 Q4 7 11 10 26 4 3 29 15 30 31 R1 32 16 27 Features * Power MOS 7(R) FREDFETs - Low RDSon - Low input and Miller capacitance - Low gate charge - Fast intrinsic reverse diode - Avalanche energy rated - Very rugged * Kelvin source for easy drive * Very low stray inductance - Symmetrical design * Internal thermistor for temperature monitoring * High level of integration Benefits * Outstanding performance at high frequency operation * Direct mounting to heatsink (isolated package) * Low junction to case thermal resistance * Solderable terminals both for power and signal for easy PCB mounting * Low profile * Each leg can be easily paralleled to achieve a phase leg of twice the current capability 28 27 26 25 29 30 23 22 20 19 18 16 15 31 32 2 3 4 7 8 10 11 12 14 13 All multiple inputs and outputs must be shorted together Example: 13/14 ; 29/30 ; 22/23 ... Absolute maximum ratings Symbol VDSS ID IDM VGS RDSon PD IAR EAR EAS Parameter Drain - Source Breakdown Voltage Continuous Drain Current Pulsed Drain current Gate - Source Voltage Drain - Source ON Resistance Maximum Power Dissipation Avalanche current (repetitive and non repetitive) Repetitive Avalanche Energy Single Pulse Avalanche Energy Tc = 25C Tc = 80C Tc = 25C V m W A mJ These Devices are sensitive to Electrostatic Discharge. Proper Handing Procedures Should Be Followed. APT website - http://www.advancedpower.com 1-6 APTM50HM65FT3 - Rev 0 September, 2004 Max ratings 500 51 38 204 30 65 390 51 50 3000 Unit V A APTM50HM65FT3 All ratings @ Tj = 25C unless otherwise specified Electrical Characteristics Symbol BVDSS IDSS RDS(on) VGS(th) IGSS Characteristic Drain - Source Breakdown Voltage Zero Gate Voltage Drain Current Drain - Source on Resistance Gate Threshold Voltage Gate - Source Leakage Current Test Conditions VGS = 0V, ID = 250A Min 500 VGS = 0V,VDS = 500V VGS = 0V,VDS = 400V Typ Max 250 1000 65 5 100 Unit V A m V nA Tj = 25C Tj = 125C 3 VGS = 10V, ID = 25.5A VGS = VDS, ID = 2.5mA VGS = 30 V, VDS = 0V Dynamic Characteristics Symbol Ciss Coss Crss Qg Qgs Qgd Td(on) Tr Td(off) Tf Eon Eoff Eon Eoff Characteristic Input Capacitance Output Capacitance Reverse Transfer Capacitance Total gate Charge Gate - Source Charge Gate - Drain Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Turn-on Switching Energy Turn-off Switching Energy Turn-on Switching Energy Turn-off Switching Energy Test Conditions VGS = 0V VDS = 25V f = 1MHz VGS = 10V VBus = 250V ID = 51A Inductive switching @ 125C VGS = 15V VBus = 333V ID = 51A R G = 3 Inductive switching @ 25C VGS = 15V, VBus = 333V ID = 51A, R G = 3 Inductive switching @ 125C VGS = 15V, VBus = 333V ID = 51A, R G = 3 Min Typ 7000 1400 90 140 40 70 21 38 75 93 1035 845 1556 1013 Max Unit pF nC ns J J Source - Drain diode ratings and characteristics Symbol IS VSD dv/dt trr Qrr Characteristic Continuous Source current (Body diode) Diode Forward Voltage Peak Diode Recovery Reverse Recovery Time Reverse Recovery Charge Test Conditions Tc = 25C Tc = 80C Min Typ VGS = 0V, IS = - 51A IS = - 51A VR = 250V diS/dt = 100A/s IS = - 51A VR = 250V diS/dt = 100A/s Tj = 25C Tj = 125C Tj = 25C Tj = 125C 2.6 9.6 Max 51 38 1.3 15 270 540 Unit A V V/ns ns C APTM50HM65FT3 - Rev 0 September, 2004 Eon includes diode reverse recovery. In accordance with JEDEC standard JESD24-1. dv/dt numbers reflect the limitations of the circuit rather than the device itself. IS - 51A di/dt 700A/s VR VDSS Tj 150C APT website - http://www.advancedpower.com 2-6 APTM50HM65FT3 Thermal and package characteristics Symbol RthJC VISOL TJ TSTG TC Torque Wt Characteristic Junction to Case RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz Min 2500 -40 -40 -40 Typ Max 0.32 150 125 100 4.7 110 Unit C/W V C N.m g Operating junction temperature range Storage Temperature Range Operating Case Temperature Mounting torque Package Weight To heatsink M4 Temperature sensor NTC Symbol Characteristic R25 Resistance @ 25C B 25/85 T25 = 298.16 K Min Typ 68 4080 Max Unit k K RT = R 25 1 1 exp B25 / 85 T - T 25 T: Thermistor temperature RT : Thermistor value at T Package outline 1 12 APT website - http://www.advancedpower.com 3-6 APTM50HM65FT3 - Rev 0 September, 2004 17 28 APTM50HM65FT3 Typical Performance Curve Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration 0.35 Thermal Impedance (C/W) 0.3 0.25 0.2 0.15 0.1 0.05 0.3 0.1 0.05 0.0001 0.001 0.9 0.7 0.5 Single Pulse 0.01 0.1 1 10 0 0.00001 rectangular Pulse Duration (Seconds) Low Voltage Output Characteristics 200 ID, Drain Current (A) 160 120 80 40 5.5V 0 0 VGS =10&15V 7V 6.5V 6V 5V 25 ID, Drain Current (A) 8V 150 125 100 75 50 25 0 0 2 4 6 8 VGS, Gate to Source Voltage (V) DC Drain Current vs Case Temperature 60 ID, DC Drain Current (A) Normalized to VGS =10V @ 25.5A Transfert Characteristics V DS > ID(on)xRDS(on)MAX 250s pulse test @ < 0.5 duty cycle TJ =25C TJ =125C TJ=-55C 5 10 15 20 VDS, Drain to Source Voltage (V) RDS(on) vs Drain Current RDS(on) Drain to Source ON Resistance 1.1 1.05 50 40 30 20 10 0 APTM50HM65FT3 - Rev 0 September, 2004 VGS=10V 1 VGS =20V 0.95 0.9 0 10 20 30 40 50 ID, Drain Current (A) 60 25 50 75 100 125 TC, Case Temperature (C) 150 APT website - http://www.advancedpower.com 4-6 APTM50HM65FT3 RDS(on), Drain to Source ON resistance (Normalized) Breakdown Voltage vs Temperature BVDSS, Drain to Source Breakdown Voltage (Normalized) 1.2 1.1 1.0 0.9 0.8 0.7 -50 -25 0 25 50 75 100 125 150 TJ, Junction Temperature (C) Threshold Voltage vs Temperature 1.2 VGS(TH), Threshold Voltage (Normalized) 1.1 1.0 0.9 0.8 0.7 0.6 -50 -25 0 25 50 75 100 125 150 TC, Case Temperature (C) Capacitance vs Drain to Source Voltage 100000 C, Capacitance (pF) Ciss Coss 1000 Crss 1000 I D, Drain Current (A) limited by RDSon ON resistance vs Temperature 2.5 2.0 1.5 1.0 0.5 0.0 -50 -25 0 25 50 75 100 125 150 TJ, Junction Temperature (C) Maximum Safe Operating Area VGS=10V ID= 25.5A 100 100 us 1 ms 10 ms 10 1 Single pulse TJ =150C 1 100 ms 0.1 10 100 1000 VDS, Drain to Source Voltage (V) Gate Charge vs Gate to Source Voltage VGS, Gate to Source Voltage (V) 14 12 10 8 6 4 2 0 0 25 50 75 100 125 150 175 APTM50HM65FT3 - Rev 0 September, 2004 VDS=400V ID=51A TJ=25C VDS=100V VDS=250V 10000 100 10 0 10 20 30 40 VDS, Drain to Source Voltage (V) 50 Gate Charge (nC) APT website - http://www.advancedpower.com 5-6 APTM50HM65FT3 Delay Times vs Current 80 70 td(on) and t d(off) (ns) 60 50 40 30 20 10 10 20 30 40 50 60 I D, Drain Current (A) 70 80 V DS=333V RG =3 T J=125C L=100H Rise and Fall times vs Current 160 140 120 t r and tf (ns) 100 80 60 40 20 0 10 20 30 40 50 60 ID, Drain Current (A) 70 80 VDS=333V RG=3 T J=125C L=100H td(off) tf tr td(on) Switching Energy vs Current 3 Switching Energy (mJ) 2.5 2 1.5 1 0.5 0 10 20 30 40 50 60 I D, Drain Current (A) 70 80 Eon Switching Energy (mJ) VDS=333V RG=3 TJ=125C L=100H Switching Energy vs Gate Resistance 5 4 3 2 1 0 0 5 10 15 20 25 30 35 40 45 Gate Resistance (Ohms) Source to Drain Diode Forward Voltage 1000 VDS=333V ID=51A TJ=125C L=100H Eoff Eon Eoff Operating Frequency vs Drain Current 400 Frequency (kHz) 350 300 250 200 150 100 50 0 10 15 20 25 30 35 I D, Drain Current (A) 40 45 hard switching ZCS ZVS VDS=333V D=50% RG=3 TJ=125C TC=75C I DR, Reverse Drain Current (A) 450 100 TJ =150C TJ =25C 10 1 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 APTM50HM65FT3 - Rev 0 September, 2004 VSD, Source to Drain Voltage (V) APT reserves the right to change, without notice, the specifications and information contained herein APT's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. U.S and Foreign patents pending. All Rights Reserved. APT website - http://www.advancedpower.com 6-6 |
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